Seica Inc., Vice President, David Sigillo, will be presenting ‘virtually’ at the Flex Conference & Expo this February exploring the test methodologies relevant to the new age of flexible circuits for 2021. This will be an “on demand” event. You may register to attend by following the link below. https://flex.semi.org/program/fhe-systems-flexible-circuit-testing-methodologies
Rapid H4 Flex Next is the unique solution dedicated to test flex PCBs directly in the production Reel, is the most versatile and high performance flying probe test system in the world for fixtureless test technology. The flying probe system is a fixtureless, full automated solution for Reel to Reel test. Providing 4 mobile test
DeviceClip è il nuovo programmatore universale, progettato per la programmazione In-System (ISP) di dispositivi a semiconduttore. Il design multicanale permette programmare in parallelo fino a 4 target diversi con un unico modulo DeviceClip. Per programmare fino a 64 target contemporaneamente, è sufficiente collegare in cascata fino a 16 moduli DeviceClip. Le sue dimensioni estremamente compatte e
From Lean production to Industry 4.0 Defining a test strategy is one of the broadest and most complex aspects of electronic production. How it is managed is mainly determined by the combination of two aspects: the first is related to technical/production issues, the second is cost. The quick and continuous changes in the market first
Seica will take part to the Panel Discussion: “Effective test strategies for assembled boards” on Tuesday, November 10th. The broadcast will be held at 7:30am (PCT), 10:30am (EST), 3:30pm (GMT), 4:30pm (CET). Post-reflow there are a variety of test procedures to check the efficacy of the assembled PCBA, ranging from AOI to ICT, Boundary Scan,
Because of the environmental conditions in which Printed Circuits Boards (PCBs) are requested to work, it is necessary to protect them. Some of the challenges are humidity, a wide range of temperatures, dust and chemical contamination. A solutions that has been adopted since the ’60s is covering the boards with a thin layer plastic material.
The globalization of the markets facilitated the transformation of the industrial structure towards sectors where productivity becomes higher. In an effort to increase significantly their throughput capability, the electronic manufacturing focus on finding the right strategic investment decisions to perform rapid and reliable tests of their electronic assembly products. The aim of this article is
Seica, Inc., the North American subsidiary of Seica S.p.A., will be exhibiting at the SMTA International, Live Virtual Exposition to be held on September 28 – 30, 2020. This will be a virtual event managed by https://smta.org/mpage/smtai. Attendees can register at this event at the URL listed above and navigate to the Seica, Inc. booth where
In order to be able to continue with all the activities and, most importantly, to pay attention to the safety of the workplace, please read carefully the following points. In Seica SpA the following rules are currently in force for entering and staying at the company: Access is forbidden to those who show any symptoms
