Seica takes part at Robotic Soldering – when does it make sense? – Robotic soldering is quickly becoming more affordable and effective in electronics assembly. This panel will discuss the latest developments and benefits of introducing this key technology.
Seica is pleased to invite to the Webinar June 10 – Register Now In the world of electronic board test, for many years flying probers have been considered good enough for prototype testing only, but today some of them can achieve unprecedented high performances in terms of quality and throughput, becoming a perfect solution also for
For years the means to test flexible circuits or Flexible Hybrid Electronics (FHE) have varied. From very simple and straight forward continuity and isolation testing seen in traditional printed circuit board (PCB) substrates using grid testers to now flying probe testers offering the end-user/contract manufacturer or original equipment manufacturer (OEM) more flexibility in the production
Seica is pleased to invite you to a Seica Live Event: EV Manufacturing Challenges: Seica Tests Electric We will analyze the latest test solutions for automotive electronics, with special focus on Electrical Vehicles. Save the date March 25 and select your time: 11:00 or 16:00 (Central Europe Time). Register Now!!
Seica is pleased to invite you to the Webinar: Electrical test of flex PCBs in a reel to reel configuration, March 11. We will explore the latest methodologies relevant to the growing demand for testing FLEX PCBs, driven by the rapid and transversal implementation throughout the industries of consumer electronics, automotive, medical, smart home, wearables
In collaboration wih Smarteam, Seica will attend the Productronica 2021 with products that represent the highest level of technology applied to testing of electronic boards and components. In booth E5/5228 Seica will showcase the Pilot V8 NEXT, which, with its innovative and powerful electrical testing performance, is undoubtedly the most complete flying probing test platform on the market.
Seica Inc., Vice President, David Sigillo, will be presenting ‘virtually’ at the Flex Conference & Expo this February exploring the test methodologies relevant to the new age of flexible circuits for 2021. This will be an “on demand” event. You may register to attend by following the link below. https://flex.semi.org/program/fhe-systems-flexible-circuit-testing-methodologies
Seica will take part to the Panel Discussion: “Effective test strategies for assembled boards” on Tuesday, November 10th. The broadcast will be held at 7:30am (PCT), 10:30am (EST), 3:30pm (GMT), 4:30pm (CET). Post-reflow there are a variety of test procedures to check the efficacy of the assembled PCBA, ranging from AOI to ICT, Boundary Scan,
