For years the means to test flexible circuits or Flexible Hybrid Electronics (FHE) have varied. From very simple and straight forward continuity and isolation testing seen in traditional printed circuit board (PCB) substrates using grid testers to now flying probe testers offering the end-user/contract manufacturer or original equipment manufacturer (OEM) more flexibility in the production
Seica is pleased to invite you to a Seica Live Event: EV Manufacturing Challenges: Seica Tests Electric We will analyze the latest test solutions for automotive electronics, with special focus on Electrical Vehicles. Save the date March 25 and select your time: 11:00 or 16:00 (Central Europe Time). Register Now!!
Seica is pleased to invite you to the Webinar: Electrical test of flex PCBs in a reel to reel configuration, March 11. We will explore the latest methodologies relevant to the growing demand for testing FLEX PCBs, driven by the rapid and transversal implementation throughout the industries of consumer electronics, automotive, medical, smart home, wearables
In collaboration wih Smarteam, Seica will attend the Productronica 2021 with products that represent the highest level of technology applied to testing of electronic boards and components. In booth E5/5228 Seica will showcase the Pilot V8 NEXT, which, with its innovative and powerful electrical testing performance, is undoubtedly the most complete flying probing test platform on the market.
Seica Inc., Vice President, David Sigillo, will be presenting ‘virtually’ at the Flex Conference & Expo this February exploring the test methodologies relevant to the new age of flexible circuits for 2021. This will be an “on demand” event. You may register to attend by following the link below. https://flex.semi.org/program/fhe-systems-flexible-circuit-testing-methodologies
Seica will take part to the Panel Discussion: “Effective test strategies for assembled boards” on Tuesday, November 10th. The broadcast will be held at 7:30am (PCT), 10:30am (EST), 3:30pm (GMT), 4:30pm (CET). Post-reflow there are a variety of test procedures to check the efficacy of the assembled PCBA, ranging from AOI to ICT, Boundary Scan,
Seica, Inc., the North American subsidiary of Seica S.p.A., will be exhibiting at the SMTA International, Live Virtual Exposition to be held on September 28 – 30, 2020. This will be a virtual event managed by https://smta.org/mpage/smtai. Attendees can register at this event at the URL listed above and navigate to the Seica, Inc. booth where
Seica takes part at this webinar in Italian language, organized by ComoNext, to share the experience of “Seica Virtual Factory”, the virtual factory where you can experiment seica solutions. We will tell you about the potential, areas of use and future developments of this innovative and constantly growing project. Seica partecipa a questo webinar, organizzato
