25 January 2016, Daniel Herzliya Hotel, Israel
Seica ATE 2016
A Seica SPA technological seminar was held on January 25th in Israel, at the Daniel Hotel in Herzliya, TelAviv. The event was organized by Spider Engineering, a representative and partner company of Seica in Israel.
As Mr. Antonio Grassino, President of Seica, pointed out while attending the seminar, the fact that the event was attended by such a large number of participants confirms the strategic choice of investing in the Israeli market, an investment which has already resulted in the sale and installation of two Pilot Line Flying Probers.
The 145 guests attending the seminar were shown an overview of the latest technological developments during the presentation “Technology challenges and test strategies”: reduced accessibility for test, the need to limit and certify the current and voltage values used during measurements, the need for increased performance in frequency measurements, combined with very high density circuits all pose significant challenges to the conventional functional test techniques via connectors and to in-circuit, bed of nails test. This trend is amplified by the IoT (Internet of Things) which adds 3D components, a mix of electronic, optical and mechanical technologies, as well as new materials, thus making the application of conventional board testing increasingly difficult. Boundary scan technology helps, but is far from being able to provide a complete solution to the problem as a whole. The alternative proposal is to utilize a flying probe tester which integrates all of the resources required to provide a complete range of test solutions: for example power-on test and parallel functional channels applied directly by the mobile probes.
The seminar was organized so that attendees saw a series of technological and solution-oriented presentations, alternated with real case applications directly reported by Israeli Customers who are using Seica testers.
Among the most popular topics: the potential of vertical Flying Probers and boundary scan test integration, building on the well-established concept that flying probe systems provide excellent in-circuit test and can integrate all of the features and capabilities of a functional tester.
After an in-depth technical review of measurement and test technologies, the topics of Legacy Replacement and Reverse Engineering were discussed, along with the importance and benefits of double-side test capability amply illustrated by the presentation of real case applications implemented for customers worldwide.
In addition to the technical information, Seica also presented the good results achieved by the group in 2015, the new strategies of the Company concerning territorial growth and future technical and commercial goals, particularly emphasizing the global service network provided by the parent company with its subsidiaries, ensuring worldwide, around-the-clock service.
